Invention Grant
- Patent Title: Conductivity variable composition, conductivity variable laminated body, and conductive pattern formed body
- Patent Title (中): 电导率变量组成,电导率可变层压体和导电图案成型体
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Application No.: US11390663Application Date: 2006-03-28
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Publication No.: US08142688B2Publication Date: 2012-03-27
- Inventor: Yoshihiro Kobayashi , Kiyoshi Itoh
- Applicant: Yoshihiro Kobayashi , Kiyoshi Itoh
- Applicant Address: JP Tokyo-to
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo-to
- Agency: Ladas & Parry LLP
- Priority: JP2005-095901 20050329
- Main IPC: H01B1/02
- IPC: H01B1/02

Abstract:
The present disclosure provides a conductive pattern formed body with a conductive pattern formed efficiently and highly precisely in a simple process, a conductivity variable laminated body used for formation of the conductive pattern, and the like. The disclosure provides a conductivity variable composition characterized by containing insulating particle including a conductive inorganic material and an organic material adhered on the circumference of the conductive inorganic material, and a photocatalyst.
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