Invention Grant
- Patent Title: Method for manufacturing oxide film having high dielectric constant, capacitor having dielectric film formed using the method, and method for manufacturing the same
- Patent Title (中): 具有高介电常数的氧化膜的制造方法,使用该方法形成的电介质膜的电容器及其制造方法
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Application No.: US10797046Application Date: 2004-03-11
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Publication No.: US08143660B2Publication Date: 2012-03-27
- Inventor: Jung-hyun Lee , Burn-seok Seo , Yo-sep Min , Young-jin Cho
- Applicant: Jung-hyun Lee , Burn-seok Seo , Yo-sep Min , Young-jin Cho
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2003-0015197 20030311
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
Provided are a method for manufacturing a high k-dielectric oxide film, a capacitor having a dielectric film formed using the method, and a method for manufacturing the capacitor. A high k-dielectric oxide film is manufactured by (a) loading a semiconductor substrate in an ALD apparatus, (b) depositing a reaction material having a predetermined composition rate of a first element and a second element on the semiconductor substrate, and (c) forming a first high k-dielectric oxide film having the two elements on the semiconductor substrate by oxidizing the reaction material such that the first element and the second element are simultaneously oxidized. In this method, the size of an apparatus is reduced, productivity is enhanced, and manufacturing costs are lowered. Further, the high k-dielectric oxide film exhibits high dielectric constant and low leakage current and trap density. Thus, a capacitor including the high k-dielectric oxide film as a dielectric film also exhibits low leakage current and trap density.
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