Invention Grant
- Patent Title: Semiconductor package transformer
- Patent Title (中): 半导体封装变压器
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Application No.: US12461869Application Date: 2009-08-26
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Publication No.: US08143715B2Publication Date: 2012-03-27
- Inventor: Cheol Ho Choi
- Applicant: Cheol Ho Choi
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0083719 20080827
- Main IPC: H01L23/482
- IPC: H01L23/482 ; H01L23/538
Abstract:
The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front surface and an open part exposing is formed on its upper surface; and a plurality of holes that are formed on the bottom surface of the case.
Public/Granted literature
- US20100052152A1 Semiconductor package transformer Public/Granted day:2010-03-04
Information query
IPC分类:
