Invention Grant
- Patent Title: Circuit board device, wiring board interconnection method, and circuit board module device
- Patent Title (中): 电路板装置,接线板互连方式及电路板模块装置
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Application No.: US12227803Application Date: 2007-05-14
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Publication No.: US08144482B2Publication Date: 2012-03-27
- Inventor: Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
- Applicant: Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2006-152881 20060531
- International Application: PCT/JP2007/059831 WO 20070514
- International Announcement: WO2007/138843 WO 20071206
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14

Abstract:
A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.
Public/Granted literature
- US20090135573A1 Circuit board device, wiring board interconnection method, and circuit board module device Public/Granted day:2009-05-28
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