Invention Grant
- Patent Title: Manufacturing method of printed circuit board and manufacturing apparatus for the same
- Patent Title (中): 印刷电路板的制造方法及其制造装置
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Application No.: US12232460Application Date: 2008-09-17
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Publication No.: US08144972B2Publication Date: 2012-03-27
- Inventor: Chung Woo Cho , Seon Ha Kang , Young Hwan Shin , Jong Jin Lee
- Applicant: Chung Woo Cho , Seon Ha Kang , Young Hwan Shin , Jong Jin Lee
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0071035 20080722
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
The present invention relates to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same; and, more particularly, to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same capable of improving the degree of matching between contact holes and pads by correcting exposure position data of an exposing process for forming the pads according to positions of the contact holes.
Public/Granted literature
- US20100021045A1 Manufacturing method of printed circuit board and manufacturing apparatus for the same Public/Granted day:2010-01-28
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