发明授权
US08145342B2 Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
有权
使用来自翘曲数据的反馈来调整晶片研磨机的操作的方法和系统
- 专利标题： Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
- 专利标题（中）： 使用来自翘曲数据的反馈来调整晶片研磨机的操作的方法和系统
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申请号： US12891357申请日： 2010-09-27
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公开(公告)号： US08145342B2公开(公告)日： 2012-03-27
- 发明人: Sumeet S. Bhagavat , Roland R. Vandamme , Tomomi Komura , Tomhiko Kaneko , Takuto Kazama
- 申请人： Sumeet S. Bhagavat , Roland R. Vandamme , Tomomi Komura , Tomhiko Kaneko , Takuto Kazama
- 申请人地址： US MO St. Peters
- 专利权人： MEMC Electronic Materials, Inc.
- 当前专利权人： MEMC Electronic Materials, Inc.
- 当前专利权人地址： US MO St. Peters
- 代理机构： Armstrong Teasdale LLP
- 主分类号： G06F19/00
- IPC分类号： G06F19/00 ; G03C5/00 ; G03F7/00 ; H01L21/302 ; H01L21/461 ; B24B49/00 ; B24B51/00 ; B24B1/00 ; B24B7/00 ; B24B9/00 ; B24B29/00 ; B24B5/00
摘要：
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.
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