发明授权
- 专利标题： Conductive polymer composites
- 专利标题（中）： 导电聚合物复合材料
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申请号： US10823311申请日： 2004-04-13
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公开(公告)号： US08147962B2公开(公告)日： 2012-04-03
- 发明人: Che-Hsiung Hsu , Christopher P. Junk , Sunghan Kim , Daniel David Lecloux , Ralph Birchard Lloyd , Shiva Prakash
- 申请人： Che-Hsiung Hsu , Christopher P. Junk , Sunghan Kim , Daniel David Lecloux , Ralph Birchard Lloyd , Shiva Prakash
- 申请人地址： US DE Wilmington
- 专利权人： E. I. du Pont de Nemours and Company
- 当前专利权人： E. I. du Pont de Nemours and Company
- 当前专利权人地址： US DE Wilmington
- 主分类号： B32B9/00
- IPC分类号： B32B9/00 ; H01L51/00 ; H01L51/54
摘要：
The invention relates to conductive polymer composites comprising a first layer comprising at least one electrically doped conductive polymer and a second layer comprising at least one material selected from a colloid-forming polymeric acid, a salt of a colloid-forming polymeric acid, a non-polymeric fluorinated organic acid, and a salt of a non-polymeric fluorinated organic acid.
公开/授权文献
- US20050227081A1 Conductive polymer composites 公开/授权日：2005-10-13
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