发明授权
- 专利标题: Formed ceramic receiver element adhered to a semiconductor lamina
- 专利标题(中): 形成的陶瓷接收元件粘附到半导体层
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申请号: US12826762申请日: 2010-06-30
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公开(公告)号: US08148189B2公开(公告)日: 2012-04-03
- 发明人: Aditya Agarwal , Kathy J Jackson
- 申请人: Aditya Agarwal , Kathy J Jackson
- 申请人地址: US CA San Jose
- 专利权人: Twin Creeks Technologies, Inc.
- 当前专利权人: Twin Creeks Technologies, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: The Mueller Law Office, P.C.
- 主分类号: H01L31/18
- IPC分类号: H01L31/18 ; H01L21/71
摘要:
A method is described to create a thin semiconductor lamina adhered to a ceramic body. The method includes defining a cleave plane in a semiconductor donor body, applying a ceramic mixture to a first face of the semiconductor body, the ceramic mixture including ceramic powder and a binder, curing the ceramic mixture to form a ceramic body, and cleaving a lamina from the semiconductor donor body at the cleave plane, the lamina remaining adhered to the ceramic body. Forming the ceramic body this way allows outgassing of volatiles during the curing step. Devices can be formed in the lamina, including photovoltaic devices. The ceramic body and lamina can withstand high processing temperatures. In some embodiments, the ceramic body may be conductive.