Invention Grant
US08148207B2 Method of making a semiconductor chip assembly with a post/base/cap heat spreader
有权
制造具有柱/底/盖散热器的半导体芯片组件的方法
- Patent Title: Method of making a semiconductor chip assembly with a post/base/cap heat spreader
- Patent Title (中): 制造具有柱/底/盖散热器的半导体芯片组件的方法
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Application No.: US12626940Application Date: 2009-11-30
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Publication No.: US08148207B2Publication Date: 2012-04-03
- Inventor: Charles W. C. Lin , Chia-Chung Wang , David M. Sigmond
- Applicant: Charles W. C. Lin , Chia-Chung Wang , David M. Sigmond
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agent David M. Sigmond
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
Public/Granted literature
- US20100075448A1 METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/CAP HEAT SPREADER Public/Granted day:2010-03-25
Information query
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