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US08148750B2 Transistor device having asymmetric embedded strain elements and related manufacturing method 有权
具有不对称嵌入式应变元件的晶体管器件及相关制造方法

Transistor device having asymmetric embedded strain elements and related manufacturing method
Abstract:
Semiconductor transistor devices and related fabrication methods are provided. An exemplary transistor device includes a layer of semiconductor material having a channel region defined therein and a gate structure overlying the channel region. Recesses are formed in the layer of semiconductor material adjacent to the channel region, such that the recesses extend asymmetrically toward the channel region. The transistor device also includes stress-inducing semiconductor material formed in the recesses. The asymmetric profile of the stress-inducing semiconductor material enhances carrier mobility in a manner that does not exacerbate the short channel effect.
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