A heat dissipation device adapted for cooling an electronic device mounted on a printed circuit board comprises a base plate adapted for being thermally attached to the electronic device and a clip attached on a top face of the base plate. The base plate comprises two protruding poles protruding downwardly from a bottom face thereof. The protruding poles are capable of extending through the printed circuit board, thereby establishing a location for the heat dissipation device on the printed circuit board. The clip fastens the heat dissipation device on the printed circuit board after the location for the heat dissipation device on the printed circuit board has been established.