Invention Grant
- Patent Title: Microwave integrated circuit package and method for forming such package
- Patent Title (中): 微波集成电路封装及其形成方法
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Application No.: US13113317Application Date: 2011-05-23
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Publication No.: US08153449B2Publication Date: 2012-04-10
- Inventor: Michael G. Adlerstein , Francois Y. Colomb
- Applicant: Michael G. Adlerstein , Francois Y. Colomb
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for packaging a semiconductor device. The method includes: providing a dielectric layer over the semiconductor device; determining patterns and placement of material on the dielectric layer to provide a predetermined magnetic or electric effect for the device, such effects being provided on the device from such patterned and placed material solely by electrical or magnetic waves coupled between such material and the device; and forming the material in the determined patterns and placement to provide the predetermined effects.
Public/Granted literature
- US20110223692A1 MICROWAVE INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FORMING SUCH PACKAGE Public/Granted day:2011-09-15
Information query
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