Invention Grant
- Patent Title: Memory device and method of fabricating the same
- Patent Title (中): 存储器件及其制造方法
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Application No.: US12318502Application Date: 2008-12-30
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Publication No.: US08154010B2Publication Date: 2012-04-10
- Inventor: Seung-Hyun Lee
- Applicant: Seung-Hyun Lee
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: KR10-2008-0090384 20080912
- Main IPC: H01L29/12
- IPC: H01L29/12 ; H01L21/20

Abstract:
A memory device includes a first electrode, a second electrode spaced apart from the first electrode and a nanotube or nanowire network disposed between the first electrode and the second electrode, having a stacked structure of a P-type network and an N-type network, and having a diode characteristic. Since the nanotube or nanowire network has the stacked structure of the P-type network and the N-type network, and has the diode characteristic, it is possible to enhance a degree of integration of the memory device and simplify the fabrication processes without separately requiring a selection device.
Public/Granted literature
- US20100065817A1 Memory device and method of fabricating the same Public/Granted day:2010-03-18
Information query
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