发明授权
- 专利标题： Semiconductor device having a chip-size package
- 专利标题（中）： 具有芯片尺寸封装的半导体器件
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申请号： US12000745申请日： 2007-12-17
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公开(公告)号： US08154124B2公开(公告)日： 2012-04-10
- 发明人: Yoshikazu Takahashi , Masami Suzuki , Masaru Kimura
- 申请人： Yoshikazu Takahashi , Masami Suzuki , Masaru Kimura
- 申请人地址： JP Tokyo
- 专利权人： Oki Electric Industry Co., Ltd.
- 当前专利权人： Oki Electric Industry Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Venable LLP
- 代理商 Jeffri A. Kaminski
- 优先权： JP8-322847 19961203; JP9-129931 19970520
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/04 ; H01L23/053 ; H01L23/12 ; H01L23/29
摘要：
A semiconductor chip has a main surface, a back surface and a plurality of side surfaces. A plurality of electrodes is provided on the main surface of the semiconductor chip so as to be arranged in a plurality of lines. An insulating film is formed on the main surface of the semiconductor chip so as to expose at least one of the plurality of electrodes. A plurality of leads are formed on the insulating film, each of the plurality of leads having a first end and a second end, and the first end of the lead being connected to the one of the plurality of electrodes. A base resin film is formed on the insulting film and the plurality of leads, the base resin film having a plurality of electrodes holes exposing a part of the second end of each of the leads and a device hole in which the first end of the lead and the one of the plurality of electrodes are located.
公开/授权文献
- US20090146287A1 Semiconductor device having a chip-size package 公开/授权日：2009-06-11