Invention Grant
- Patent Title: Acoustic wave device and method for manufacturing the same
- Patent Title (中): 声波装置及其制造方法
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Application No.: US12546188Application Date: 2009-08-24
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Publication No.: US08154170B2Publication Date: 2012-04-10
- Inventor: Masanori Kimura , Shunichi Aikawa , Keji Tsuda , Hikomasa Oshita
- Applicant: Masanori Kimura , Shunichi Aikawa , Keji Tsuda , Hikomasa Oshita
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2008-217062 20080826
- Main IPC: H01L41/047
- IPC: H01L41/047 ; H03H9/25

Abstract:
An acoustic wave device includes: a piezoelectric substrate on which an acoustic wave element and an electrode pad connected to the acoustic wave element are formed; a first resin part having a first opening located above a function area in which an acoustic wave is excited by the acoustic wave element and a second opening located above the electrode pad; a second resin part that covers the first opening and has a third opening located above the second opening; and a metal layer formed on the electrode pad in the second opening, the first opening and the second opening being inversely tapered.
Public/Granted literature
- US20100052473A1 ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-03-04
Information query
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