Invention Grant
US08154722B2 Sensor element structure, sensor element array, and manufacturing method of sensor element array
有权
传感器元件结构,传感器元件阵列和传感器元件阵列的制造方法
- Patent Title: Sensor element structure, sensor element array, and manufacturing method of sensor element array
- Patent Title (中): 传感器元件结构,传感器元件阵列和传感器元件阵列的制造方法
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Application No.: US11677890Application Date: 2007-02-22
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Publication No.: US08154722B2Publication Date: 2012-04-10
- Inventor: Tomohiro Yamada , Yoichiro Handa
- Applicant: Tomohiro Yamada , Yoichiro Handa
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2006-057908 20060303
- Main IPC: G01J3/44
- IPC: G01J3/44

Abstract:
Even when only a few antigens exist in a specimen, a change in a dielectric constant and a change in an optical spectrum accompanied thereto in the periphery of a conductive member are made larger, so that sensing at high sensitivity can be performed. A structure including a protrusion including a dielectric material protruded on a substrate and a conductive member provided on a first surface of the protrusion, in which the maximum value of the cross-sectional area in the cross-section in parallel with a first surface of the conductive member is larger than the area of the first surface.
Public/Granted literature
- US20070206194A1 SENSOR ELEMENT STRUCTURE, SENSOR ELEMENT ARRAY, AND MANUFACTURING METHOD OF SENSOR ELEMENT ARRAY Public/Granted day:2007-09-06
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