发明授权
- 专利标题： Method for polishing a semiconductor wafer
- 专利标题（中）： 抛光半导体晶片的方法
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申请号： US12542920申请日： 2009-08-18
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公开(公告)号： US08157617B2公开(公告)日： 2012-04-17
- 发明人: Clemens Zapilko , Thomas Jaeschke , Makoto Tabata , Klaus Roettger
- 申请人： Clemens Zapilko , Thomas Jaeschke , Makoto Tabata , Klaus Roettger
- 申请人地址： DE Munich
- 专利权人： Siltronic AG
- 当前专利权人： Siltronic AG
- 当前专利权人地址： DE Munich
- 代理机构： Brooks Kushman P.C.
- 优先权： DE102008045534 20080903
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.
公开/授权文献
- US20100056027A1 Method For Polishing A Semiconductor Wafer 公开/授权日：2010-03-04
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