Invention Grant
US08158519B2 Method of manufacturing non-volatile memory cell using self-aligned metal silicide
有权
使用自对准金属硅化物制造非易失性存储单元的方法
- Patent Title: Method of manufacturing non-volatile memory cell using self-aligned metal silicide
- Patent Title (中): 使用自对准金属硅化物制造非易失性存储单元的方法
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Application No.: US12254022Application Date: 2008-10-20
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Publication No.: US08158519B2Publication Date: 2012-04-17
- Inventor: Yi-Hsiu Chen , Yung-Chung Lee , Yider Wu
- Applicant: Yi-Hsiu Chen , Yung-Chung Lee , Yider Wu
- Applicant Address: TW
- Assignee: Eon Silicon Solution Inc.
- Current Assignee: Eon Silicon Solution Inc.
- Current Assignee Address: TW
- Agency: Schmeiser, Olsen & Watts, LLP
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L21/00 ; H01L21/8238 ; H01L21/44

Abstract:
In a method of manufacturing a non-volatile memory cell, a self-aligned metal silicide is used in place of a conventional tungsten metal layer to form a polysilicon gate, and the self-aligned metal silicide is used as a connection layer on the polysilicon gate. By using the self-aligned metal silicide to form the polysilicon gate, the use of masks in the etching process may be saved to thereby enable simplified manufacturing process and accordingly, reduced manufacturing cost. Meanwhile, the problem of resistance shift caused by an oxidized tungsten metal layer can be avoided.
Public/Granted literature
- US20100099262A1 METHOD OF MANUFACTURING NON-VOLATILE MEMORY CELL USING SELF-ALIGNED METAL SILICIDE Public/Granted day:2010-04-22
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