发明授权
- 专利标题: Electromagnetic bandgap structure and printed circuit board
- 专利标题(中): 电磁带隙结构和印刷电路板
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申请号: US12213571申请日: 2008-06-20
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公开(公告)号: US08158889B2公开(公告)日: 2012-04-17
- 发明人: Han Kim , Je-Gwang Yoo
- 申请人: Han Kim , Je-Gwang Yoo
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2007-0061829 20070622; KR10-2007-0061831 20070622
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H01P3/08
摘要:
An electromagnetic bandgap structure and a printed circuit board are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure includes a mushroom type structure comprising a first metal plate and a via of which one end is connected to the first metal plate; a second metal plate connected to the other end of the via; a first metal layer being connected to the second metal layer through a metal line; a first dielectric layer, layer-built between the first metal layer and the first metal plate; a second dielectric layer, layer-built on the first metal plate and the first dielectric layer; and a second metal layer, layer-built on the second dielectric layer. With the present invention, it is possible to solve the aforementioned mixed signal problem by preventing the EM wave of a certain frequency range from being transferred.
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