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发明授权
US08159064B2 Lead pin for package substrate, and method for manufacturing package substrate with the same 有权
用于封装衬底的引脚，以及用于制造封装衬底的方法

Lead pin for package substrate, and method for manufacturing package substrate with the same
摘要：
Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an opposite side to the one surface; and a connection pin having a pin shape bonded to the other surface of the head part, wherein the head part has a concave depression part toward the package substrate.
摘要（中）：

这里公开了一种用于封装衬底的引脚。 根据本发明的示例性实施例的封装基板的引脚包括具有与封装基板相对的一个表面和与该表面相对的另一个表面的头部; 以及具有与所述头部的另一个表面接合的销形状的连接销，其中，所述头部具有朝向所述封装基板的凹陷部。

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