发明授权
- 专利标题： Substrate, communication module, and communication apparatus
- 专利标题（中）： 基板，通信模块和通信装置
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申请号： US12372365申请日： 2009-02-17
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公开(公告)号： US08159315B2公开(公告)日： 2012-04-17
- 发明人: Jun Tsutsumi , Kazuhiro Matsumoto
- 申请人： Jun Tsutsumi , Kazuhiro Matsumoto
- 申请人地址： JP Tokyo
- 专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Chen Yoshimura LLP
- 优先权： JP2008-038927 20080220
- 主分类号： H03H7/38
- IPC分类号： H03H7/38
摘要：
A substrate for mounting a filter has a connection line layer having a transmission line for connecting a filter, a ground layer placed below the connection line layer and having a ground, and an insulation layer placed between the transmission line and the ground layer and having a thickness which satisfies a characteristic impedance of the transmission line in a range 0.1 to 50 ohms, the characteristic impedance determined by the thickness and a dielectric constant of the insulation layer and a width of the transmission line.
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