发明授权
- 专利标题: Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network
- 专利标题(中): 多层片式电容器,具有相同的主板设备和配电网络
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申请号: US12270330申请日: 2008-11-13
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公开(公告)号: US08159813B2公开(公告)日: 2012-04-17
- 发明人: Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
- 申请人: Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
- 申请人地址: KR Gyunggi-do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Gyunggi-do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2008-0030383 20080401; KR10-2008-0056543 20080616
- 主分类号: H01G4/005
- IPC分类号: H01G4/005 ; H01G4/06
摘要:
There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged in a laminated direction; and first to fourth outer electrodes formed on side surfaces of the capacitor body, respectively, wherein the first capacitor unit includes first and second inner electrodes of different polarities alternately arranged in the capacitor body to oppose each other while interposing a corresponding one of dielectric layers, the second capacitor unit includes third and fourth inner electrodes of different polarities alternately arranged in the capacitor body to oppose each other while interposing another corresponding one of the dielectric layers, the first and second capacitor units are electrically insulated from each other, and the first capacitor unit operates in a first frequency range and the second capacitor unit operates in a second frequency range lower than the first frequency range.
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