Invention Grant
- Patent Title: Methods for manufacturing and packaging floor panels, devices used thereby, as well as floor panel and packed set of floor panels
- Patent Title (中): 制造和包装地板镶板,使用的装置以及地板和地板镶板的方法
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Application No.: US11887363Application Date: 2006-03-28
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Publication No.: US08161701B2Publication Date: 2012-04-24
- Inventor: Mark Cappelle , Lode De Boe
- Applicant: Mark Cappelle , Lode De Boe
- Applicant Address: LU Bertrange
- Assignee: Flooring Industries Limited, SARL
- Current Assignee: Flooring Industries Limited, SARL
- Current Assignee Address: LU Bertrange
- Agency: Bacon & Thomas, PLLC
- Priority: BE2005/0169 20050331; BE2006/0024 20060112
- International Application: PCT/IB2006/000993 WO 20060328
- International Announcement: WO2006/103565 WO 20061005
- Main IPC: E04F13/08
- IPC: E04F13/08 ; E04F15/14 ; E04F15/22 ; E04B1/62 ; E04C3/00

Abstract:
Method for manufacturing floor panels, wherein is started from panels (1), these panels (1), at their lower side (9), are provided with at least one guiding groove (22) and these panels (1), at least at two opposite sides (3A-3B/4A-4B), are provided with profiled edge regions (5A-5B) that comprise coupling parts (17A-17B), characterized in that at least one of the aforementioned two profiled edge regions (5A-5B) is formed such that this region, seen in a cross-section of the panel (1), transverse to the guiding groove (22), extends at the lower side (9) of the panel (1) at least up to the guiding groove (22). Further, the invention also relates to still other methods, for manufacturing as well as packaging of floor panels, and also relates to devices used therewith, as well as to floor panels.
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