Invention Grant
US08162510B2 LED chip package structure with multifunctional integrated chips and a method for making the same
有权
具有多功能集成芯片的LED芯片封装结构及其制造方法
- Patent Title: LED chip package structure with multifunctional integrated chips and a method for making the same
- Patent Title (中): 具有多功能集成芯片的LED芯片封装结构及其制造方法
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Application No.: US12285027Application Date: 2008-09-29
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Publication No.: US08162510B2Publication Date: 2012-04-24
- Inventor: Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
- Applicant: Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
- Applicant Address: TW Hsinchu
- Assignee: Harvatek Corporation
- Current Assignee: Harvatek Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Rosenberg, Klein & Lee
- Priority: TW97106385A 20080222
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A LED chip package structure with multifunctional integrated chips includes a substrate unit, a light-emitting unit, a chip unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The chip unit is electrically arranged on the substrate unit, and the chip unit is arranged between the light-emitting unit and a power source. The package colloid unit covers the LED chips. The package colloid unit is a strip fluorescent colloid corresponding to the LED chips.
Public/Granted literature
- US20090212304A1 Led chip package structure with multifunctional integrated chips and a method for making the same Public/Granted day:2009-08-27
Information query
IPC分类:
