Invention Grant
- Patent Title: Wiring structure for use in micro piezoelectric pump
- Patent Title (中): 用于微型压电泵的接线结构
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Application No.: US12330367Application Date: 2008-12-08
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Publication No.: US08162628B2Publication Date: 2012-04-24
- Inventor: Hsien-Kai Meng , Shu-Pin Hsieh , Chieh-Ming Hsiung , Chien-Hua Lin , Yu-Chung Hsu , Tai-Shuan Lin
- Applicant: Hsien-Kai Meng , Shu-Pin Hsieh , Chieh-Ming Hsiung , Chien-Hua Lin , Yu-Chung Hsu , Tai-Shuan Lin
- Applicant Address: TW Taoyuan Hsien
- Assignee: Microbase Technology Corp.
- Current Assignee: Microbase Technology Corp.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Apex Juris, pllc
- Agent Tracy M Heims
- Priority: TW97135312A 20080915
- Main IPC: F04B17/00
- IPC: F04B17/00

Abstract:
An electrical connection structure for use in a micro piezoelectric pump is disclosed. The electrical connection structure includes a driving circuit board and a multilayered wiring structure. The electrical connection structure includes the driving circuit board, the wiring structure, and a piezoelectric element arranged from top to bottom. The driving circuit board is provided with a driving circuit for driving the piezoelectric element and at least an electrical contact, wherein the electrical contacts are electrically connected to the driving circuit. A first electrode contact region and a second electrode contact region electrically insulated from each other are defined on the same surface of the piezoelectric element. The wiring structure sends a signal from the electrical contacts to the first electrode contact region and the second electrode contact region.
Public/Granted literature
- US20100068080A1 WIRING STRUCTURE FOR USE IN MICRO PIEZOELECTRIC PUMP Public/Granted day:2010-03-18
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