Invention Grant
- Patent Title: Apparatus for feeding resin
- Patent Title (中): 树脂进料装置
-
Application No.: US12670411Application Date: 2008-09-03
-
Publication No.: US08162654B2Publication Date: 2012-04-24
- Inventor: Hideto Monzen , Hiroyuki Hashimoto , Hotaka Fukabori , Takuya Fujikawa , Hiroshi Hayashi , Tsuneo Imatani
- Applicant: Hideto Monzen , Hiroyuki Hashimoto , Hotaka Fukabori , Takuya Fujikawa , Hiroshi Hayashi , Tsuneo Imatani
- Applicant Address: JP Tokyo
- Assignee: Toyo Seikan Kaisha, Ltd.
- Current Assignee: Toyo Seikan Kaisha, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2007-238926 20070914
- International Application: PCT/JP2008/065871 WO 20080903
- International Announcement: WO2009/034892 WO 20090319
- Main IPC: B29B11/02
- IPC: B29B11/02

Abstract:
Apparatus for feeding molten resin includes a holding unit that moves on a track and at least a pair of holders capable of holding and releasing the molten resin accompanying the opening and closing of the holding unit. A base portion is utilized for supporting the holders so as to be opened and closed and for holding the molten resin together with the holders. The molten resin discharged from an extrusion-forming machine and cut by a cutter is held by the holding unit, and it fed from the holding unit to a female mold of a compression-0molding machine. At the time of cutting the molten resin, a cutter mark is formed by the cutter on a cut surface of the molten resin.
Public/Granted literature
- US20100209727A1 APPARATUS FOR FEEDING RESIN Public/Granted day:2010-08-19
Information query