Invention Grant
- Patent Title: Receptacle structure, printed wiring board structure, and electronic device
- Patent Title (中): 插座结构,印刷线路板结构和电子设备
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Application No.: US12837517Application Date: 2010-07-16
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Publication No.: US08162671B2Publication Date: 2012-04-24
- Inventor: Ryou Matsubara , Shouichi Mimura , Hirotsugu Fusayasu , Masafumi Kumoi , Toshiyuki Nakaie
- Applicant: Ryou Matsubara , Shouichi Mimura , Hirotsugu Fusayasu , Masafumi Kumoi , Toshiyuki Nakaie
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Shinjyu Global IP
- Priority: JP2010-033996 20100218
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A receptacle structure includes a housing structure, a terminal insulating board, a first terminal and a second terminal. The housing structure is configured to be mounted on a printed wiring board and to accommodate a plug. The terminal insulating board includes a top face and a bottom face that is opposite to the top face. The terminal insulating board is disposed inside the housing structure with the bottom face facing towards the printed wiring board. The first terminal is connected to the printed wiring board via the first rear connection part and to the terminal insulating board. The second terminal is connected to the printed wiring board via the first front connection part and to the terminal insulating board. The first front connection part has a width narrower than the first rear connection part and is connected to the printed wiring board away from the first rear connection part.
Public/Granted literature
- US20110201214A1 RECEPTACLE STRUCTURE, PRINTED WIRING BOARD STRUCTURE, AND ELECTRONIC DEVICE Public/Granted day:2011-08-18
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