发明授权
- 专利标题: Percutaneous instrument assembly
- 专利标题(中): 经皮仪器组装
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申请号: US11737819申请日: 2007-04-20
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公开(公告)号: US08162952B2公开(公告)日: 2012-04-24
- 发明人: Dan S. Cohen , Nicholas J. Bender , Oliver Buchert , Rui J. Ferreira
- 申请人: Dan S. Cohen , Nicholas J. Bender , Oliver Buchert , Rui J. Ferreira
- 申请人地址: US NJ Parsippany
- 专利权人: EBI, LLC
- 当前专利权人: EBI, LLC
- 当前专利权人地址: US NJ Parsippany
- 代理机构: Harness, Dickey
- 主分类号: A61F2/00
- IPC分类号: A61F2/00
摘要:
An instrument for multi-level percutaneous spinal procedures. The instrument can include a curved rack having length adapted for at least substantially spanning first and second vertebrae and one or more intermediate vertebrae between the first and second vertebrae. The instrument can include first and second towers correspondingly engageable with the first and second vertebrae, and one or more intermediate towers engageable with the intermediate vertebrae. Further, the instrument can include first and second arms adapted for movably connecting the first and second towers to the rack, and one or more intermediate arms adapted for movably connecting the intermediate tower to the rack.
公开/授权文献
- US20080077138A1 PERCUTANEOUS INSTRUMENT ASSEMBLY 公开/授权日:2008-03-27