发明授权
US08163599B2 Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
失效
倒装芯片安装方法，倒装芯片安装装置和倒装芯片安装装置中使用的工具保护片
- 专利标题： Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
- 专利标题（中）： 倒装芯片安装方法，倒装芯片安装装置和倒装芯片安装装置中使用的工具保护片
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申请号： US12933819申请日： 2009-03-30
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公开(公告)号： US08163599B2公开(公告)日： 2012-04-24
- 发明人: Yoshihiro Tomura , Kentaro Kumazawa , Takayuki Higuchi , Koujiro Nakamura
- 申请人： Yoshihiro Tomura , Kentaro Kumazawa , Takayuki Higuchi , Koujiro Nakamura
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2008-108400 20080418
- 国际申请： PCT/JP2009/001432 WO 20090330
- 国际公布： WO2009/128206 WO 20091022
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.