Invention Grant
- Patent Title: Discrete semiconductor device and method of forming sealed trench junction termination
- Patent Title (中): 分立半导体器件及形成密封沟槽结端接方法
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Application No.: US12182660Application Date: 2008-07-30
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Publication No.: US08163624B2Publication Date: 2012-04-24
- Inventor: Ronald R. Bowman
- Applicant: Ronald R. Bowman
- Agency: Patent Law Group: Atkins & Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: H01L21/76
- IPC: H01L21/76

Abstract:
A discrete semiconductor device has a substrate with a first conductivity type of semiconductor material. A first semiconductor layer is formed over the substrate. The first semiconductor layer having the first conductivity type of semiconductor material. A second semiconductor layer over the first semiconductor layer. The second semiconductor layer has a second conductivity type of semiconductor material. A trench is formed through the second semiconductor layer and extends into the second semiconductor layer. The trench has a rounded or polygonal shape and vertical sidewalls. The trench is lined with an insulating layer and filled with an insulating material. A boundary between the first and second semiconductor layers forms a p-n junction. The trench surrounds the p-n junction to terminate the electric field of a voltage imposed on the second semiconductor layer. The discrete semiconductor device can also be a transistor, thyristor, triac, or transient voltage suppressor.
Public/Granted literature
- US20100025807A1 Discrete Semiconductor Device and Method of Forming Sealed Trench Junction Termination Public/Granted day:2010-02-04
Information query
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