Invention Grant
- Patent Title: Method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications
- Patent Title (中): 用于多频带和超宽带应用的阻抗优化微带传输线的方法，结构和设计结构
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Application No.: US12542368Application Date: 2009-08-17
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Publication No.: US08164397B2Publication Date: 2012-04-24
- Inventor: Guoan Wang , Wayne H. Woods, Jr.
- Applicant: Guoan Wang , Wayne H. Woods, Jr.
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: H03H7/38
- IPC: H03H7/38
Abstract:
A method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications. A method includes: forming a plurality of openings in a ground plane associated with a signal line; forming a plurality of capacitance plates in the plurality of openings; and connecting the plurality of capacitance plates to the signal line with a plurality of posts extending between the signal line and the plurality of capacitance plates.
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