Invention Grant
- Patent Title: Methods and systems for enhancing local repair in robust header compression
- Patent Title (中): 强化头部压缩的局部修复方法和系统
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Application No.: US11096694Application Date: 2005-03-31
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Publication No.: US08165104B2Publication Date: 2012-04-24
- Inventor: Parag Arun Agashe , Haipeng Jin , Rohit Kapoor
- Applicant: Parag Arun Agashe , Haipeng Jin , Rohit Kapoor
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Kristine U. Ekwueme
- Main IPC: H04L12/28
- IPC: H04L12/28
Abstract:
Methods and systems to enhance local repair in robust header compression (ROHC) decompressors (110, 114), which may improve network transmission efficiency and quality. One method uses lower layer information to enhance local repair at the decompressor (110, 114). Another method uses a User Datagram Protocol (UDP) checksum to enhance local repair at the decompressor (110, 114).
Public/Granted literature
- US20060120352A1 Methods and systems for enhancing local repair in robust header compression Public/Granted day:2006-06-08
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