发明授权
- 专利标题: Method of fabricating systems including heat-sensitive memory devices
- 专利标题(中): 制造包括热敏记忆装置的系统的方法
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申请号: US12631267申请日: 2009-12-04
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公开(公告)号: US08166234B2公开(公告)日: 2012-04-24
- 发明人: Jun-Ho Jang , Woonjae Chung , Hungjun An
- 申请人: Jun-Ho Jang , Woonjae Chung , Hungjun An
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel Sibley & Sajovec, P.A.
- 优先权: KR10-2008-0127440 20081215
- 主分类号: G06F13/00
- IPC分类号: G06F13/00
摘要:
A system code is stored in a first nonvolatile memory. The first nonvolatile memory and a second nonvolatile memory are heated during assembly of an electronic device including the first nonvolatile memory and a second nonvolatile memory. The heating is to a temperature sufficient to change a state of at least some memory cells in the second nonvolatile memory device. After the heating, the system code stored in the first nonvolatile memory is copied into the second nonvolatile memory. The first nonvolatile memory may he less vulnerable to temperature-related data alteration than the second nonvolatile memory. For example, the first nonvolatile memory may include a NAND flash memory and the second nonvolatile memory may include a variable resistance memory.