Invention Grant
- Patent Title: Horizontally engineered hardwood floor and method of installation
- Patent Title (中): 水平设计的硬木地板和安装方法
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Application No.: US12249522Application Date: 2008-10-10
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Publication No.: US08166718B2Publication Date: 2012-05-01
- Inventor: David C. Liu
- Applicant: David C. Liu
- Agency: Wang Law Firm, Inc.
- Agent Li K. Wang
- Main IPC: E04F15/22
- IPC: E04F15/22
Abstract:
Horizontally engineered floor boards are provided by this invention. The floor board includes a top decorative layer placed on a plurality of strips. The plurality of strips are arranged to have some in X-axis orientation and some in Y-axis orientation. The plurality of strips also has characteristics that allow the wood floor board to be installed as a tile.
Public/Granted literature
- US20100088990A1 Horizontally Engineered Hardwood Floor and Method of Installation Public/Granted day:2010-04-15
Information query
