A printed circuit board, a component package that includes the printed circuit board, and a method of manufacturing the component package are disclosed. The printed circuit board, which may include an insulation layer, a pad formed over the insulation layer and wire-bonded to a component, and a tin (Sn) alloy layer formed over the pad, can be manufactured with lower costs and a simpler manufacturing process, where the adhesion provided by the wire-bonding can also be increased.