Invention Grant
- Patent Title: Circuit board with jumper structure
- Patent Title (中): 电路板带跳线结构
-
Application No.: US12894147Application Date: 2010-09-30
-
Publication No.: US08169275B2Publication Date: 2012-05-01
- Inventor: Wen-Tsai Tsai , Wen-Chen Lan
- Applicant: Wen-Tsai Tsai , Wen-Chen Lan
- Applicant Address: TW Hsinchu Science Park, Hsinchu
- Assignee: Wistron NeWeb Corporation
- Current Assignee: Wistron NeWeb Corporation
- Current Assignee Address: TW Hsinchu Science Park, Hsinchu
- Agent Winston Hsu; Scott Margo
- Priority: TW99121044A 20100628
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H01P5/02
Abstract:
A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal transmission line is formed on a first plane of the substrate, and coupled to a first signal end and a second signal end. A first signal transmitted on the first signal transmission line in a combination method of a microstrip line to co-planar waveguide transition and a co-planar waveguide to microstrip line transition. The second signal transmission line is formed on the second plane of the substrate, and coupled to a third signal end and a fourth signal end. A second signal is transmitted on the second signal transmission line in the co-planar waveguide transmission.
Public/Granted literature
- US20110316644A1 CIRCUIT BOARD WITH JUMPER STRUCTURE Public/Granted day:2011-12-29
Information query
