Invention Grant
- Patent Title: Coil unit, method of manufacturing the same, and electronic instrument
- Patent Title (中): 线圈单元，制造方法和电子仪器
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Application No.: US12071256Application Date: 2008-02-19
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Publication No.: US08169286B2Publication Date: 2012-05-01
- Inventor: Minoru Hasegawa , Masao Kuroda
- Applicant: Minoru Hasegawa , Masao Kuroda
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-039887 20070220
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/02
Abstract:
A coil unit includes a planar coil, a printed circuit board that includes a planar coil placement section that receives the planar coil, a protective sheet that is provided on a transmission side of the planar coil and protects the planar coil, and a magnetic sheet that is provided on a non-transmission side of the planar coil. The planar coil is placed in the planar coil placement section and is electrically connected to the printed circuit board. The planar coil placement section has a shape that corresponds to an external shape of the planar coil.
Public/Granted literature
- US20080197960A1 Coil unit, method of manufacturing the same, and electronic instrument Public/Granted day:2008-08-21
Information query
