Invention Grant
- Patent Title: Keypad assembly
- Patent Title (中): 键盘装配
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Application No.: US12711583Application Date: 2010-02-24
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Publication No.: US08172413B2Publication Date: 2012-05-08
- Inventor: Muh Fong Chung , Choon Guan Ko , Sian Tatt Lee , Fook Chuin Ng
- Applicant: Muh Fong Chung , Choon Guan Ko , Sian Tatt Lee , Fook Chuin Ng
- Applicant Address: SG Singapore
- Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H04M1/22
- IPC: H04M1/22
Abstract:
A keypad assembly having a light guide sheet having a first surface with a layer of graphics printed thereon, a second surface opposite the first surface, and an edge surface; and a flexible sheet having a central portion engaged with the light guide sheet second surface and having a peripheral portion positioned in light blocking relationship with the light guide sheet edge surface.
Public/Granted literature
- US20110203911A1 KEYPAD ASSEMBLY Public/Granted day:2011-08-25
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