发明授权
US08173050B2 Conductive pattern formation ink, conductive pattern and wiring substrate
失效
导电图案形成墨水,导电图案和布线基板
- 专利标题: Conductive pattern formation ink, conductive pattern and wiring substrate
- 专利标题(中): 导电图案形成墨水,导电图案和布线基板
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申请号: US12331687申请日: 2008-12-10
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公开(公告)号: US08173050B2公开(公告)日: 2012-05-08
- 发明人: Naoyuki Toyoda , Toshiyuki Kobayashi , Sachiko Endo , Noboru Uehara , Akihiko Tsunoya
- 申请人: Naoyuki Toyoda , Toshiyuki Kobayashi , Sachiko Endo , Noboru Uehara , Akihiko Tsunoya
- 申请人地址: JP
- 专利权人: Seiko Epson Corporation
- 当前专利权人: Seiko Epson Corporation
- 当前专利权人地址: JP
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: JP2007-320244 20071211
- 主分类号: H01B1/20
- IPC分类号: H01B1/20
摘要:
A conductive pattern formation ink which can be stably ejected in the form of liquid droplets and form a conductive pattern having high reliability, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink in the form of liquid droplets on a surface of a ceramic molded body using a liquid droplet ejecting method, the ceramic molded body being made of a material containing ceramic particles and a binder. The ink contains a water-based dispersion medium, and metal particles dispersed in the water-based dispersion medium, wherein the water-based dispersion medium contains oxygen molecules and nitrogen molecules, and wherein when the water-based dispersion medium is analyzed using a gas chromatography method, a total amount of the oxygen and nitrogen molecules contained in the water-based dispersion medium is 12 ppm or less.