Invention Grant
- Patent Title: Substrate structures applied in flexible electrical devices and fabrication method thereof
- Patent Title (中): 柔性电气装置中应用的基板结构及其制造方法
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Application No.: US12330061Application Date: 2008-12-08
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Publication No.: US08173249B2Publication Date: 2012-05-08
- Inventor: Chyi-Ming Leu , Yueh-Chuan Huang , Jung-Yu Liao
- Applicant: Chyi-Ming Leu , Yueh-Chuan Huang , Jung-Yu Liao
- Applicant Address: TW
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: TW97135351A 20080915
- Main IPC: B32B7/02
- IPC: B32B7/02 ; B05D5/06
Abstract:
A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention also provides a method for fabricating the substrate structure.
Public/Granted literature
- US20100068483A1 SUBSTRATE STRUCTURES APPLIED IN FLEXIBLE ELECTRICAL DEVICES AND FABRICATION METHOD THEREOF Public/Granted day:2010-03-18
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