Invention Grant
- Patent Title: Method for positioning spacers for pitch multiplication
- Patent Title (中): 定位用于间距乘法的间隔物的方法
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Application No.: US13179851Application Date: 2011-07-11
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Publication No.: US08173550B2Publication Date: 2012-05-08
- Inventor: Sanket Sant , Gurtej Sandhu , Neal R. Rueger
- Applicant: Sanket Sant , Gurtej Sandhu , Neal R. Rueger
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L21/302
- IPC: H01L21/302

Abstract:
Multiple pitch-multiplied spacers are used to form mask patterns having features with exceptionally small critical dimensions. One of each pair of spacers formed around a plurality of mandrels is removed and alternating layers, formed of two mutually selectively etchable materials, are deposited around the remaining spacers. Layers formed of one of the materials are then etched, leaving behind vertically-extending layers formed of the other of the materials, which form a mask pattern. Alternatively, instead of depositing alternating layers, amorphous carbon is deposited around the remaining spacers followed by a plurality of cycles of forming pairs of spacers on the amorphous carbon, removing one of the pairs of spacers and depositing an amorphous carbon layer. The cycles can be repeated to form the desired pattern. Because the critical dimensions of some features in the pattern can be set by controlling the width of the spaces between spacers, exceptionally small mask features can be formed.
Public/Granted literature
- US20110269252A1 METHOD FOR POSITIONING SPACERS FOR PITCH MULTIPLICATION Public/Granted day:2011-11-03
Information query
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