Invention Grant
- Patent Title: Adhesives
- Patent Title (中): 粘合剂
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Application No.: US12597917Application Date: 2008-05-06
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Publication No.: US08173737B2Publication Date: 2012-05-08
- Inventor: Mario Scholz , Juergen Meyer , Juergen Heym , Pia Buckel
- Applicant: Mario Scholz , Juergen Meyer , Juergen Heym , Pia Buckel
- Applicant Address: DE Essen
- Assignee: Evonik Degussa GmbH
- Current Assignee: Evonik Degussa GmbH
- Current Assignee Address: DE Essen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE102007024099 20070522
- International Application: PCT/EP2008/055565 WO 20080506
- International Announcement: WO2008/141929 WO 20081127
- Main IPC: C08K3/36
- IPC: C08K3/36
Abstract:
Adhesive, comprising silanized, structurally modified, pyrogenically prepared silicas containing on their surface fixed vinyl groups or vinylsilyl groups, with hydrophobic groups, such as trimethylsilyl and/or dimethylsilyl and/or monomethylsilyl, additionally being fixed on the surface.
Public/Granted literature
- US20100137485A1 ADHESIVES Public/Granted day:2010-06-03
Information query
