Invention Grant
- Patent Title: Silicone resin composition
- Patent Title (中): 硅树脂组合物
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Application No.: US12340003Application Date: 2008-12-19
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Publication No.: US08173743B2Publication Date: 2012-05-08
- Inventor: Keisuke Hirano
- Applicant: Keisuke Hirano
- Applicant Address: JP Ibaraki-Shi
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-332712 20071225; JP2008-278574 20081029
- Main IPC: C08L83/05
- IPC: C08L83/05 ; C08K3/22
Abstract:
A silicone resin composition obtainable by reacting a bifunctional alkoxysilane and a trifunctional alkoxysilane in the presence of a dispersion of fine metal oxide particles. The silicone resin composition is suitably used in backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like.
Public/Granted literature
- US20090163654A1 SILICONE RESIN COMPOSITION Public/Granted day:2009-06-25
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