Invention Grant
US08174069B2 Power semiconductor device and a method of forming a power semiconductor device
有权
功率半导体器件和形成功率半导体器件的方法
- Patent Title: Power semiconductor device and a method of forming a power semiconductor device
- Patent Title (中): 功率半导体器件和形成功率半导体器件的方法
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Application No.: US12186231Application Date: 2008-08-05
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Publication No.: US08174069B2Publication Date: 2012-05-08
- Inventor: Florin Udrea , Vasantha Pathirana , Tanya Trajkovic , Nishad Udugampola
- Applicant: Florin Udrea , Vasantha Pathirana , Tanya Trajkovic , Nishad Udugampola
- Applicant Address: GB Cambridge
- Assignee: Cambridge Semiconductor Limited
- Current Assignee: Cambridge Semiconductor Limited
- Current Assignee Address: GB Cambridge
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
A power semiconductor device has a top surface and an opposed bottom surface below a part of which is a thick portion of semiconductor substrate. At least a portion of a drift region of the device has either no or only a thin portion of semiconductor substrate positioned thereunder. The top surface has a high voltage terminal and a low voltage terminal connected thereto to allow a voltage to be applied laterally across the drift region. At least two MOS (metal-oxide-semiconductor) gates are provided on the top surface. The device has at least one relatively highly doped region at its top surface extending between and in contact with said first and second MOS gates. The device has improved protection against triggering of parasitic transistors or latch-up without the on-state voltage drop or switching speed being compromised.
Public/Granted literature
- US20100032712A1 POWER SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A POWER SEMICONDUCTOR DEVICE Public/Granted day:2010-02-11
Information query
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