发明授权
- 专利标题: Fuse structure
- 专利标题(中): 保险丝结构
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申请号: US12503641申请日: 2009-07-15
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公开(公告)号: US08174091B2公开(公告)日: 2012-05-08
- 发明人: Kong-Beng Thei , Chung Long Cheng , Chung-Shi Liu , Harry Chuang , Shien-Yang Wu , Shi-Bai Chen
- 申请人: Kong-Beng Thei , Chung Long Cheng , Chung-Shi Liu , Harry Chuang , Shien-Yang Wu , Shi-Bai Chen
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L29/00
- IPC分类号: H01L29/00
摘要:
An electrical fuse and a method of forming the same are presented. A first-layer conductive line is formed over a base material. A via is formed over the first-layer conductive line. The via preferably comprises a barrier layer and a conductive material. A second-layer conductive line is formed over the via. A first external pad is formed coupling to the first-layer conductive line. A second external pad is formed coupling to the second-layer conductive line. The via, the first conductive line and the second conductive line are adapted to be an electrical fuse. The electrical fuse can be burned out by applying a current. The vertical structure of the preferred embodiment is suitable to be formed in any layer.
公开/授权文献
- US20090273055A1 Fuse Structure 公开/授权日:2009-11-05
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