发明授权
US08174830B2 System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
有权
具有用于热扩散和冷却的内部泵送液态金属的衬底的系统和方法
- 专利标题： System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
- 专利标题（中）： 具有用于热扩散和冷却的内部泵送液态金属的衬底的系统和方法
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申请号： US12116126申请日： 2008-05-06
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公开(公告)号： US08174830B2公开(公告)日： 2012-05-08
- 发明人: Nathan P. Lower , Ross K. Wilcoxon , Qizhou Yao , David W. Dlouhy , John A. Chihak
- 申请人： Nathan P. Lower , Ross K. Wilcoxon , Qizhou Yao , David W. Dlouhy , John A. Chihak
- 申请人地址： US IA Cedar Rapis
- 专利权人： Rockwell Collins, Inc.
- 当前专利权人： Rockwell Collins, Inc.
- 当前专利权人地址： US IA Cedar Rapis
- 代理商 Donna P. Suchy; Daniel M. Barbieri
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F28F7/00 ; H01L23/34
摘要：
A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.
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