发明授权
US08174844B2 Wired circuit board and connection structure between wired circuit boards
有权
有线电路板和有线电路板之间的连接结构
- 专利标题： Wired circuit board and connection structure between wired circuit boards
- 专利标题（中）： 有线电路板和有线电路板之间的连接结构
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申请号： US12654034申请日： 2009-12-08
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公开(公告)号： US08174844B2公开(公告)日： 2012-05-08
- 发明人: Hitoki Kanagawa , Akinori Itokawa , Naotaka Higuchi
- 申请人： Hitoki Kanagawa , Akinori Itokawa , Naotaka Higuchi
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO Corporation
- 当前专利权人： NITTO DENKO Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Edwards Neils PLLC
- 代理商 Jean C. Edwards, Esq.
- 优先权： JP2008-322566 20081218
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.
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