Invention Grant
US08177577B2 Printed wiring board having a substrate with higher conductor density inserted into a recess of another substrate with lower conductor density
有权
将具有较高导体密度的基板的印刷电路板插入具有较低导体密度的另一基板的凹槽中
- Patent Title: Printed wiring board having a substrate with higher conductor density inserted into a recess of another substrate with lower conductor density
- Patent Title (中): 将具有较高导体密度的基板的印刷电路板插入具有较低导体密度的另一基板的凹槽中
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Application No.: US12453718Application Date: 2009-05-20
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Publication No.: US08177577B2Publication Date: 2012-05-15
- Inventor: Michimasa Takahashi
- Applicant: Michimasa Takahashi
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.
Public/Granted literature
- US20090290318A1 Printed wiring board and method for manufacturing the same Public/Granted day:2009-11-26
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