Invention Grant
- Patent Title: Thermal compressive bond head
- Patent Title (中): 热压接头
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Application No.: US12901273Application Date: 2010-10-08
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Publication No.: US08177862B2Publication Date: 2012-05-15
- Inventor: Chien Ling Hwang , Cheng-Chung Lin , Ying-Jui Huang , Chung-Shi Liu
- Applicant: Chien Ling Hwang , Cheng-Chung Lin , Ying-Jui Huang , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/58
- IPC: H01L21/58
Abstract:
A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump.
Public/Granted literature
- US20120088362A1 Thermal Compressive Bond Head Public/Granted day:2012-04-12
Information query
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