Invention Grant
US08178188B2 Base layer for manufacturing an electronic component by an etching process
失效
用于通过蚀刻工艺制造电子部件的基底层
- Patent Title: Base layer for manufacturing an electronic component by an etching process
- Patent Title (中): 用于通过蚀刻工艺制造电子部件的基底层
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Application No.: US12339826Application Date: 2008-12-19
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Publication No.: US08178188B2Publication Date: 2012-05-15
- Inventor: Keiichi Nakao , Yukihiro Shimasaki , Atsushi Iwase , Koji Shimoyama
- Applicant: Keiichi Nakao , Yukihiro Shimasaki , Atsushi Iwase , Koji Shimoyama
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2001-122442 20010420; JP2008-303972 20081128
- Main IPC: B41M5/00
- IPC: B41M5/00 ; B44C1/17 ; G03G7/00
Abstract:
A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.
Public/Granted literature
- US20090104384A1 METHOD OF MANUFACTURING BASE LAYER, INK FOR INKJET AND ELECTRONIC COMPONENTS Public/Granted day:2009-04-23
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